IPTA12G011 WB -Transimp. Ampl, 4 ch, Wire Bond - Bare die
IPTA12G011-WBNVIDIA / Mellanox · Module · Silicon (ICs) Series
End of sale · 2628 days ago
IPTA12G011 WB -Transimp. Ampl, 4 ch, Wire Bond - Bare die reached end of sale on (2628 days ago).
- Notice published
- 7y 4mo ago
- End of sale
- 7y 2mo ago
- End of support
- Not announced
- Replacement
- None recorded
Source scope: NVIDIA EOL / manufacture-discontinue notice. Last Time Buy is the last order date; Last Ship Date is in extra. No end-of-support date unless the notice states one.
KEV assessment: No entries for this vendor in this KEV snapshot; this does not establish device safety or cover third-party components. Coverage details.
Lifecycle Milestones
| Lifecycle notice published | 7y 4mo ago | |
|---|---|---|
| End of sale | 7y 2mo ago |
Additional Dates
| Last Ship Date | 6y 8mo ago |
|---|
IPTA12G011 WB -Transimp. Ampl, 4 ch, Wire Bond - Bare die Lifecycle Overview
The NVIDIA / Mellanox IPTA12G011 WB -Transimp. Ampl, 4 ch, Wire Bond - Bare die (IPTA12G011-WB) is a module product in the NVIDIA / Mellanox Silicon (ICs) series. This product has reached end of sale as of and can no longer be ordered from NVIDIA / Mellanox.